JPH0585588B2 - - Google Patents

Info

Publication number
JPH0585588B2
JPH0585588B2 JP22870386A JP22870386A JPH0585588B2 JP H0585588 B2 JPH0585588 B2 JP H0585588B2 JP 22870386 A JP22870386 A JP 22870386A JP 22870386 A JP22870386 A JP 22870386A JP H0585588 B2 JPH0585588 B2 JP H0585588B2
Authority
JP
Japan
Prior art keywords
weight
resin
coating film
parts
conductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP22870386A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6383178A (ja
Inventor
Kazumasa Eguchi
Fumio Nakaya
Shinichi Wakita
Hisatoshi Murakami
Tsunehiko Terada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta Electric Wire and Cable Co Ltd
Original Assignee
Tatsuta Electric Wire and Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Electric Wire and Cable Co Ltd filed Critical Tatsuta Electric Wire and Cable Co Ltd
Priority to JP22870386A priority Critical patent/JPS6383178A/ja
Publication of JPS6383178A publication Critical patent/JPS6383178A/ja
Publication of JPH0585588B2 publication Critical patent/JPH0585588B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder

Landscapes

  • Paints Or Removers (AREA)
  • Conductive Materials (AREA)
JP22870386A 1986-09-26 1986-09-26 導電塗料 Granted JPS6383178A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22870386A JPS6383178A (ja) 1986-09-26 1986-09-26 導電塗料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22870386A JPS6383178A (ja) 1986-09-26 1986-09-26 導電塗料

Publications (2)

Publication Number Publication Date
JPS6383178A JPS6383178A (ja) 1988-04-13
JPH0585588B2 true JPH0585588B2 (en]) 1993-12-08

Family

ID=16880480

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22870386A Granted JPS6383178A (ja) 1986-09-26 1986-09-26 導電塗料

Country Status (1)

Country Link
JP (1) JPS6383178A (en])

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5156771A (en) * 1989-05-31 1992-10-20 Kao Corporation Electrically conductive paste composition
JPH03173007A (ja) * 1989-12-01 1991-07-26 Kao Corp 導電性ペースト及び導電性塗膜
JP2008124030A (ja) * 2007-11-30 2008-05-29 Jsr Corp 導電性ペースト組成物、転写フィルムおよびプラズマディスプレイパネル
CN115295202B (zh) * 2022-07-06 2025-08-01 广州市儒兴科技股份有限公司 一种晶体硅太阳能电池正面银浆用有机载体及其制备方法

Also Published As

Publication number Publication date
JPS6383178A (ja) 1988-04-13

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